#FLEPS2021

Mark Your Calendars

Important Dates

Call for Papers

The IEEE International Conference on Flexible, Printable Sensors and Systems (FLEPS 2021) will be held virtually.

IEEE FLEPS 2021 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems

Topics of Interest

  • Organic/Inorganic Electronic Sensors
  • Emerging Materials for Flexible and Printable Systems
  • Manufacturing Techniques
  • High-throughput Printable Electronics
  • Hybrid Flexible Sensors and Electronics
  • Stretchable/Shrinkable Sensors and Electronics
  • Soft/Smart Wearable and Implantable Sensing Systems
  • Disposable/Reusable Sensors and Electronics
  • Printed Large-Area Sensors and Systems
  • Flexible or Printed Active and Passive Components (e.g.
    actuators, printed energy devices, smart labels, RFID etc.)
  • Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
  • Simulation and Modelling
  • Flexible/Printable Electronics in context with Circular Economy and green electronics

Publication of Papers

Presented papers will be included in the Proceedings of IEEE FLEPS 2021 and in IEEE Xplore pending author requirements being met. Authors may submit an extended IEEE FLEPS 2021 papers to the Special Journal Issue in the IEEE Sensors Journal.

Exhibition & Patron Opportunities

The Conference exhibit area will provide your company or organization with the opportunity to inform and display your latest products, services, equipment, books, journals, and publications to attendees from around the world.

For further information, contact Coral Miller at Conference Catalysts, LLC.

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